Download e-book for kindle: Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin

By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

ISBN-10: 0071626239

ISBN-13: 9780071626231

A finished advisor to 3D MEMS packaging equipment and options Written through specialists within the box, complex MEMS Packaging serves as a invaluable reference for these confronted with the demanding situations created by way of the ever-increasing curiosity in MEMS units and packaging. This authoritative consultant provides state-of-the-art MEMS (microelectromechanical structures) packaging strategies, equivalent to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you choose trustworthy, inventive, high-performance, powerful, and budget friendly packaging innovations for MEMS units. The publication also will reduction in stimulating extra examine and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, tactics, production, checking out, and reliability. one of the subject matters explored: complicated IC and MEMS packaging traits MEMS units, advertisement functions, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding strategies Actuation mechanisms and built-in micromachining Bubble change, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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Peterson, Kenneth A. (Albuquerque, NM), Conley, William R. (Tijeras, NM), “Pre-release plastic packaging of MEMS and IMEMS devices,” April 30, 2002. 2 Peterson, Kenneth A. (Albuquerque, NM), Conley, William R. (Tijeras, NM), “Protection of microelectronic devices during packaging,” January 1, 2002. Tilmans, Hendrikus A. C. (Maastricht, NL), Beyne, Eric (Leuven, BE), Van de Peer, Myriam (Brussel, BE), “Method of fabrication of a microstructure having an internal cavity,” October 2, 2001. Japanese MEMS Packaging Patents Some of the Japanese MEMS packaging patents selected from the Japan Patent Office (JPO) since 2001 are as follows: Patent No.

Sandy Hook, CT), Subbanna, Seshadri (Brewster, NY), Volant, Richard P. (New Fairfield, CT), “Micro-electromechanical varactor with enhanced tuning range,” December 9, 2003. 19 20 Chapter One 6,643,065 6,639,313 6,635,509 6,627,814 6,624,003 6,580,858 6,535,685 6,516,131 6,516,104 6,481,570 6,455,878 6,400,009 6,379,988 Silberman, Donn Michael (Aliso Viejo, CA), “Variable spacing diffraction grating,” November 4, 2003. Martin, John R. (Foxborough, MA), Harney, Kieran H. (Andover, MA), “Hermetic seals for large optical packages and the like,” October 28, 2003.

2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2006. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2005. 2004. 2004. 2004. 2004. 2004. 2004. 2003. 2003. 2003. 2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05. 2. “Method for packaging an optical MEMS device,” Khonsari, Nassim (US), Chui, Clarence (US), EP2029473 (A2)—200903-04.

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Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin


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